Research & Development

Innovation-Driven, Technology-Leading

R&D Philosophy

Meikyo Tech adheres to the concept of innovation drives development and regards R&D innovation as the company core competitiveness. We are committed to deeply integrating artificial intelligence, robotics, and environmental technology to continuously break through technological bottlenecks in e-waste processing.

Core Technologies

AI Vision Recognition System

A deep learning-based intelligent recognition system with over 99% accuracy, providing the foundation for precise disassembly.

Precision Robotic Arm Control

Multi-DOF precision robotic arm control achieving sub-millimeter accuracy for safe and efficient fine disassembly.

Precision Separation Technology

Specialized tools and processes for complex internal structures, achieving precise material separation without damaging core components.

Safe & Eco-friendly Process

Innovatively developed processes for special components, effectively preventing environmental pollution and safety risks during disassembly.

Selected Patents

01

Adjustment Method for Opening Electronic Devices (China Invention Patent)

02

Hinge Mechanism and Electronic Structure (China Invention Patent)

03

An Automated Mobile Phone Disassembly Device (China Invention Patent)

04

A Screw Disassembly Device (China Invention Patent)

05

An Automated SIM Card Tray Removal Device for Mobile Phones (China Invention Patent)

06

A Universal Fixture for Fixing Mobile Phones (China Utility Model Patent)

07

An Automated Mobile Phone Disassembly Device and Method (China Invention Patent)

08

A Combined Device for Removing Bottom Screws and Side SIM Card Trays of Mobile Phones (China Invention Patent)

* More than 10 additional invention and utility model patents are currently pending

R&D Roadmap

Short-term Goals (1–2 Years)

  • Improve processing efficiency and intelligence of existing equipment
  • Expand applicable product range, develop more types of disassembly technology
  • Optimize resource recovery processes, improve rare metal recovery rates

Medium-term Goals (3–5 Years)

  • Develop next-generation fully automated disassembly production lines
  • Achieve remote monitoring and intelligent management of equipment
  • Develop disassembly technology for large electronic equipment

Long-term Vision

  • Build a full lifecycle management system for electronic products
  • Explore the design-manufacturing-use-recycling closed-loop ecosystem
  • Promote industry standard development and technological innovation